Summary Chapter Three: Design of Advanced Substrates

As the electronic products industry continues to push the envelope of extreme miniaturization, product developments teams are being forced further into the realm of high density interconnect. Design techniques and substrates labeled exotic only a few short years ago are now considered mainstream. In particular, build-up substrate usage has grown dramatically, and is now found in a large percentage of high production electronic products. This Section is to educate and inform you on the technologies, needs, issues and solutions available today for advanced substrate design. The focus will briefly cover the 4 changes to TH PCB design techniques required for HDI and the IPC Design Standard 2226.